CY37512P256-125BGI
vs
CY37384P256-100BGC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
27 X 27 MM, 2.33 MM HEIGHT, BGA-256
|
27 X 27 MM, 2.33 MM HEIGHT, BGA-256
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
YES
|
384 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
|
| Clock Frequency-Max |
83 MHz
|
80 MHz
|
| In-System Programmable |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e0
|
e0
|
| JTAG BST |
YES
|
YES
|
| Number of Dedicated Inputs |
1
|
1
|
| Number of I/O Lines |
192
|
192
|
| Number of Macro Cells |
512
|
384
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
1 DEDICATED INPUTS, 192 I/O
|
1 DEDICATED INPUTS, 192 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA256,20X20,50
|
BGA256,20X20,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
10 ns
|
12 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
1
|
1
|
| Length |
|
27 mm
|
| Seated Height-Max |
|
2.46 mm
|
| Width |
|
27 mm
|
|
|
|
Compare CY37512P256-125BGI with alternatives
Compare CY37384P256-100BGC with alternatives