CY2SSTV850ZC
vs
CDCV850DGGRG4
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
SPECTRALINEAR INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
6 X 12 MM, TSSOP-48
|
TSSOP, TSSOP48,.3,20
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
SSTV
|
850
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
| Length |
12.4965 mm
|
12.5 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
48
|
48
|
| Number of True Outputs |
10
|
10
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP48,.3,20
|
TSSOP48,.3,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Propagation Delay (tpd) |
6 ns
|
4 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.1 ns
|
0.075 ns
|
| Seated Height-Max |
1.1 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
6.096 mm
|
6.1 mm
|
| fmax-Min |
170 MHz
|
140 MHz
|
| Base Number Matches |
2
|
1
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| JESD-609 Code |
|
e4
|
| Max I(ol) |
|
0.012 A
|
| Moisture Sensitivity Level |
|
2
|
| Packing Method |
|
TR
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare CY2SSTV850ZC with alternatives
Compare CDCV850DGGRG4 with alternatives