Findchips: Compare CY29FCT520BTDMB vs 5962-9220502MLA

CY29FCT520BTDMB vs 5962-9220502MLA feature comparison

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Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	TEXAS INSTRUMENTS INC	CYPRESS SEMICONDUCTOR CORP
Part Package Code	DIP
Package Description	DIP, DIP24,.3	DIP,
Pin Count	24
Reach Compliance Code	unknown	unknown
ECCN Code	3A001.A.2.C	3A001.A.2.C
HTS Code	8542.39.00.01	8542.39.00.01
Boundary Scan	NO	NO
Clock Frequency-Max	12.5 MHz	6.25 MHz
External Data Bus Width	8	16
JESD-30 Code	R-GDIP-T24	R-GDIP-T24
Length	32.005 mm	32.005 mm
Low Power Mode	YES	NO
Number of Terminals	24	24
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Output Data Bus Width	8	8
Package Body Material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
Package Code	DIP	DIP
Package Equivalence Code	DIP24,.3	DIP24,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Qualification Status	Not Qualified	Not Qualified
Screening Level	MIL-STD-883	MIL-STD-883
Seated Height-Max	5.08 mm	5.08 mm
Supply Voltage-Max	5.5 V	5.5 V
Supply Voltage-Min	4.5 V	4.5 V
Supply Voltage-Nom	5 V	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Pitch	2.54 mm	2.54 mm
Terminal Position	DUAL	DUAL
Width	7.62 mm	7.62 mm
uPs/uCs/Peripheral ICs Type	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER
Base Number Matches	1	1
JESD-609 Code		e0
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Terminal Finish		TIN LEAD
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
	Microcontrollers and Processors » DSP Peripherals	Microcontrollers and Processors » DSP Peripherals