CY27C256-200WC
vs
NMC27C256BN200
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
0.600 INCH, WINDOWED, CERDIP-28
DIP, DIP28,.6
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.71
Access Time-Max
200 ns
200 ns
JESD-30 Code
R-GDIP-T28
R-PDIP-T28
JESD-609 Code
e0
e0
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX8
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
0.045 mA
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
I/O Type
COMMON
Length
35.725 mm
Output Characteristics
3-STATE
Package Equivalence Code
DIP28,.6
Programming Voltage
12.75 V
Seated Height-Max
5.334 mm
Standby Current-Max
0.0001 A
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare CY27C256-200WC with alternatives
Compare NMC27C256BN200 with alternatives