CY27C256-200WC
vs
AM27C256-200PI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
SPANSION INC
Part Package Code
DIP
DIP
Package Description
0.600 INCH, WINDOWED, CERDIP-28
DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.71
Access Time-Max
200 ns
80 ns
JESD-30 Code
R-GDIP-T28
R-PDIP-T28
JESD-609 Code
e0
Memory Density
262144 bit
1048576 bit
Memory IC Type
UVPROM
OTP ROM
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
64KX16
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
0.045 mA
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Length
37.084 mm
Seated Height-Max
5.715 mm
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare CY27C256-200WC with alternatives
Compare AM27C256-200PI with alternatives