CY27C010-55JC
vs
5962-8751413XA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MICROCHIP TECHNOLOGY INC
Package Description
QCCJ,
DIP,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.51
Access Time-Max
55 ns
350 ns
JESD-30 Code
R-PQCC-J32
R-GDIP-T28
Memory Density
1048576 bit
65536 bit
Memory IC Type
OTP ROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
28
Number of Words
131072 words
8192 words
Number of Words Code
128000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
8KX8
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
QCCJ
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
J BEND
THROUGH-HOLE
Terminal Position
QUAD
DUAL
Base Number Matches
2
5
Part Package Code
DIP
Pin Count
28
Additional Feature
AUTOMATIC WRITE; WITH READY/BUSY SIGNAL
JESD-609 Code
e0
Length
37.25 mm
Programming Voltage
5 V
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.72 mm
Supply Current-Max
0.045 mA
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
15.24 mm
Write Cycle Time-Max (tWC)
1 ms
Compare CY27C010-55JC with alternatives
Compare 5962-8751413XA with alternatives