CY23S08SC-3T
vs
SY89825UHITR
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
MICREL INC
|
| Part Package Code |
SOIC
|
QFP
|
| Package Description |
SOP, SOP16,.25
|
HTFQFP, TQFP64,.47SQ
|
| Pin Count |
16
|
64
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
23S
|
89825
|
| Input Conditioning |
STANDARD
|
DIFFERENTIAL MUX
|
| JESD-30 Code |
R-PDSO-G16
|
S-PQFP-G64
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.893 mm
|
10 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Max I(ol) |
0.008 A
|
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
16
|
64
|
| Number of True Outputs |
8
|
22
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HTFQFP
|
| Package Equivalence Code |
SOP16,.25
|
TQFP64,.47SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
| Prop. Delay@Nom-Sup |
0.275 ns
|
1.4 ns
|
| Propagation Delay (tpd) |
0.35 ns
|
1.4 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.3 ns
|
0.035 ns
|
| Seated Height-Max |
1.727 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2.37 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
ECL
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
3.9 mm
|
10 mm
|
| fmax-Min |
140 MHz
|
2000 MHz
|
| Base Number Matches |
1
|
2
|
| Additional Feature |
|
ALSO OPERATES AT 3.3V SUPPLY
|
| Moisture Sensitivity Level |
|
3
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare CY23S08SC-3T with alternatives
Compare SY89825UHITR with alternatives