CY2309CZXC-1H
vs
LMK00308SQ/NOPB
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
TEXAS INSTRUMENTS INC
|
| Package Description |
TSSOP-16
|
WQFN-40
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
Infineon
|
Texas Instruments
|
| Family |
2309
|
00308
|
| Input Conditioning |
STANDARD
|
DIFFERENTIAL MUX
|
| JESD-30 Code |
R-PDSO-G16
|
S-XQCC-N40
|
| JESD-609 Code |
e4
|
e3
|
| Length |
5 mm
|
6 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Max I(ol) |
0.012 A
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
16
|
40
|
| Number of True Outputs |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP16,.25
|
LCC40,.24SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
8.7 ns
|
2.7 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.2 ns
|
0.05 ns
|
| Seated Height-Max |
1.1 mm
|
0.8 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.45 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3.15 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4.4 mm
|
6 mm
|
| fmax-Min |
133.33 MHz
|
3100 MHz
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
40
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Load Capacitance (CL) |
|
5 pF
|
| Packing Method |
|
TR
|
| Power Supply Current-Max (ICC) |
|
13.5 mA
|
| Prop. Delay@Nom-Sup |
|
2.7 ns
|
|
|
|
Compare CY2309CZXC-1H with alternatives
Compare LMK00308SQ/NOPB with alternatives