LMK00308SQ/NOPB
vs
2308B-1DCG8
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
WQFN-40
|
ROHS COMPLIANT, SOIC-16
|
| Pin Count |
40
|
16
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Family |
00308
|
2308
|
| Input Conditioning |
DIFFERENTIAL MUX
|
STANDARD
|
| JESD-30 Code |
S-XQCC-N40
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
6 mm
|
9.9314 mm
|
| Load Capacitance (CL) |
5 pF
|
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
40
|
16
|
| Number of True Outputs |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Equivalence Code |
LCC40,.24SQ,20
|
SOP16,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Supply Current-Max (ICC) |
13.5 mA
|
|
| Prop. Delay@Nom-Sup |
2.7 ns
|
|
| Propagation Delay (tpd) |
2.7 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.05 ns
|
0.4 ns
|
| Seated Height-Max |
0.8 mm
|
1.7272 mm
|
| Supply Voltage-Max (Vsup) |
3.45 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3.15 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
6 mm
|
3.937 mm
|
| fmax-Min |
3100 MHz
|
133.3 MHz
|
| Base Number Matches |
1
|
2
|
| Manufacturer Package Code |
|
DCG16
|
| Max I(ol) |
|
0.008 A
|
| Technology |
|
CMOS
|
|
|
|
Compare LMK00308SQ/NOPB with alternatives
Compare 2308B-1DCG8 with alternatives