CY22E016L-SZ25XCT vs 6116SA70YB feature comparison

CY22E016L-SZ25XCT Cypress Semiconductor

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6116SA70YB Integrated Device Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code SOIC SOJ
Package Description SOP, SOJ,
Pin Count 28 24
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 70 ns
JESD-30 Code R-PDSO-G28 R-PDSO-J24
JESD-609 Code e4 e0
Length 17.905 mm
Memory Density 16384 bit 16384 bit
Memory IC Type NON-VOLATILE SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 28 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 2KX8 2KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOJ
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.67 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING J BEND
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 7.505 mm
Base Number Matches 1 1
Pbfree Code No
Screening Level MIL-STD-883 Class B

Compare CY22E016L-SZ25XCT with alternatives

Compare 6116SA70YB with alternatives