CY14B108L-BA25XIT vs CY62158DV30LL-70BVI feature comparison

CY14B108L-BA25XIT Cypress Semiconductor

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CY62158DV30LL-70BVI Rochester Electronics LLC

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Part Package Code BGA BGA
Package Description FBGA-48 6 X 8 MM, 1 MM HEIGHT, VFBGA-48
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 25 ns 70 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1 e0
Length 10 mm 8 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type NON-VOLATILE SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 1MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA VFBGA
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 235
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.2 mm 1 mm
Standby Current-Max 0.01 A
Supply Current-Max 0.075 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.2 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 NOT SPECIFIED
Width 6 mm 6 mm
Base Number Matches 2 2
Pbfree Code No

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