HM66AEB36102BP-30 vs K7P401823M-H6500 feature comparison

HM66AEB36102BP-30 Renesas Electronics Corporation

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K7P401823M-H6500 Samsung Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS TECHNOLOGY CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description LBGA, BGA165,11X15,40 BGA,
Pin Count 165 119
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 6.5 ns
Clock Frequency-Max (fCLK) 333 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B119
Length 17 mm 22 mm
Memory Density 37748736 bit 4718592 bit
Memory IC Type DDR SRAM STANDARD SRAM
Memory Width 36 18
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 165 119
Number of Words 1048576 words 262144 words
Number of Words Code 1000000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX36 256KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.46 mm
Standby Current-Max 0.35 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.88 mA
Supply Voltage-Max (Vsup) 1.9 V 3.45 V
Supply Voltage-Min (Vsup) 1.7 V 3.15 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 14 mm
Base Number Matches 1 1
Additional Feature ALSO REQUIRES 2.5V I/O SUPPLY

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