CXK77B1840A-37
vs
IS61NLF12832-10B
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SONY CORP
|
INTEGRATED SILICON SOLUTION INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
PLASTIC, BGA-119
|
Pin Count |
119
|
119
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Access Time-Max |
|
10 ns
|
Additional Feature |
|
FLOW-THROUGH ARCHITECTURE
|
Clock Frequency-Max (fCLK) |
|
83 MHz
|
I/O Type |
|
COMMON
|
JESD-30 Code |
|
R-PBGA-B119
|
JESD-609 Code |
|
e0
|
Length |
|
22 mm
|
Memory Density |
|
4194304 bit
|
Memory IC Type |
|
ZBT SRAM
|
Memory Width |
|
32
|
Number of Functions |
|
1
|
Number of Terminals |
|
119
|
Number of Words |
|
131072 words
|
Number of Words Code |
|
128000
|
Operating Mode |
|
SYNCHRONOUS
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
|
128KX32
|
Output Characteristics |
|
3-STATE
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
BGA
|
Package Equivalence Code |
|
BGA119,7X17,50
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
GRID ARRAY
|
Parallel/Serial |
|
PARALLEL
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
2.41 mm
|
Standby Current-Max |
|
0.02 A
|
Standby Voltage-Min |
|
3.14 V
|
Supply Current-Max |
|
0.3 mA
|
Supply Voltage-Max (Vsup) |
|
3.465 V
|
Supply Voltage-Min (Vsup) |
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
|
3.3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
14 mm
|
|
|
|
Compare CXK77B1840A-37 with alternatives
Compare IS61NLF12832-10B with alternatives