CXK77B1840A-37
vs
CY7C1317V18-250BZC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SONY CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
BGA,
13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
Pin Count
119
165
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Base Number Matches
1
1
Pbfree Code
Rohs Code
Access Time-Max
0.35 ns
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
250 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B165
JESD-609 Code
e0
Length
15 mm
Memory Density
16777216 bit
Memory IC Type
DDR SRAM
Memory Width
8
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
165
Number of Words
2097152 words
Number of Words Code
2000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
2MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
TBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Standby Voltage-Min
1.7 V
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
13 mm
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