CNS1N5307
vs
JANKC1N5307
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DIE
DIE
Package Description
DIE-1
DIE-1
Pin Count
1
1
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.40
8541.10.00.40
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JESD-30 Code
S-XUUC-N1
S-XUUC-N1
JESD-609 Code
e0
e0
Knee Impedance-Max
44000 Ω
Limiting Voltage-Max
2 V
2 V
Number of Elements
1
1
Number of Terminals
1
1
Operating Temperature-Max
175 °C
Operating Temperature-Min
-55 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
SQUARE
SQUARE
Package Style
UNCASED CHIP
UNCASED CHIP
Power Dissipation-Max
0.475 W
Qualification Status
Not Qualified
Not Qualified
Regulation Current-Nom (Ireg)
2.4 mA
2.4 mA
Rep Pk Reverse Voltage-Max
100 V
100 V
Surface Mount
YES
YES
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Base Number Matches
1
2
Reference Standard
MIL-19500/463
Compare CNS1N5307 with alternatives
Compare JANKC1N5307 with alternatives