CMP100AP
vs
LM360J
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
BURR-BROWN CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
PLASTIC, DIP-16
|
DIP, DIP8,.3
|
Reach Compliance Code |
unknown
|
unknown
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Input Offset Voltage-Max |
20000 µV
|
5000 µV
|
JESD-30 Code |
R-PDIP-T16
|
R-GDIP-T8
|
JESD-609 Code |
e0
|
e0
|
Neg Supply Voltage Limit-Max |
-6 V
|
-8 V
|
Neg Supply Voltage-Nom (Vsup) |
-5.2 V
|
-5 V
|
Number of Functions |
2
|
1
|
Number of Terminals |
16
|
8
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-25 °C
|
|
Output Type |
OPEN-EMITTER
|
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
DIP8,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Response Time-Nom |
3.6 ns
|
13 ns
|
Supply Voltage Limit-Max |
6 V
|
8 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
HYBRID
|
BIPOLAR
|
Temperature Grade |
OTHER
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Average Bias Current-Max (IIB) |
|
20 µA
|
Bias Current-Max (IIB) @25C |
|
20 µA
|
Seated Height-Max |
|
5.08 mm
|
Supply Current-Max |
|
32 mA
|
Width |
|
7.62 mm
|
|
|
|
Compare CMP100AP with alternatives
Compare LM360J with alternatives