CLC111AJP
vs
CLC114MDC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
WAFER
|
| Package Description |
DIP, DIP8,.3
|
DIE,
|
| Pin Count |
8
|
11
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
BUFFER
|
BUFFER
|
| Average Bias Current-Max (IIB) |
15 µA
|
5 µA
|
| Bandwidth (3dB)-Nom |
800 MHz
|
200 MHz
|
| Bias Current-Max (IIB) @25C |
15 µA
|
|
| Input Offset Voltage-Max |
9000 µV
|
8000 µV
|
| JESD-30 Code |
R-PDIP-T8
|
R-XUUC-N11
|
| JESD-609 Code |
e0
|
|
| Neg Supply Voltage Limit-Max |
-7 V
|
-7 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
11
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Current-Min |
0.05 A
|
0.02 A
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Slew Rate-Min |
2700 V/us
|
|
| Slew Rate-Nom |
3500 V/us
|
450 V/us
|
| Supply Current-Max |
12 mA
|
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare CLC111AJP with alternatives
Compare CLC114MDC with alternatives