CLC007BM/NOPB
vs
MAX256ASA+T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MAXIM INTEGRATED PRODUCTS INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HLSOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL10K
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
0.150 INCH, MS-012, SOP-8
|
| Pin Count |
|
8
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Differential Output |
|
NO
|
| Driver Number of Bits |
|
1
|
| Input Characteristics |
|
STANDARD
|
| Interface IC Type |
|
LINE DRIVER
|
| Length |
|
4.89 mm
|
| Number of Functions |
|
1
|
| Receive Delay-Max |
|
|
| Seated Height-Max |
|
1.68 mm
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
3 V
|
| Supply Voltage-Nom |
|
5 V
|
| Width |
|
3.9 mm
|
|
|
|
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