CLA4601-000
vs
CLA4601-000
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
SKYWORKS SOLUTIONS INC
|
ALPHA INDUSTRIES INC
|
| Part Package Code |
DIE
|
DIE
|
| Package Description |
GREEN, DIE-1
|
DIE-1
|
| Pin Count |
1
|
1
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.40
|
8541.10.00.40
|
| Samacsys Manufacturer |
Skyworks
|
|
| Application |
LIMITER
|
LIMITER
|
| Breakdown Voltage-Min |
15 V
|
15 V
|
| Case Connection |
CATHODE
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Max |
0.1 pF
|
0.15 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
2.5 Ω
|
2.5 Ω
|
| Diode Res Test Current |
10 mA
|
|
| Diode Res Test Frequency |
100 MHz
|
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| Frequency Band |
KA BAND
|
VERY HIGH FREQUENCY TO KA BAND
|
| JESD-30 Code |
S-XUUC-N1
|
S-XUUC-N1
|
| Minority Carrier Lifetime-Nom |
0.005 µs
|
0.005 µs
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare CLA4601-000 with alternatives
Compare CLA4601-000 with alternatives