CL31B475KAHVPNE
vs
CL31B475KAHNNWE
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
SAMSUNG ELECTRO-MECHANICS
|
SAMSUNG ELECTRO-MECHANICS
|
Package Description |
CHIP
|
CHIP, HALOGEN FREE AND ROHS COMPLIANT
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8532.24.00.20
|
8532.24.00.20
|
Factory Lead Time |
20 Weeks
|
20 Weeks
|
Capacitance |
4.7 µF
|
4.7 µF
|
Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
Dielectric Material |
CERAMIC
|
CERAMIC
|
JESD-609 Code |
e3
|
e3
|
Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
Multilayer |
Yes
|
Yes
|
Negative Tolerance |
10%
|
10%
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
Packing Method |
TR, EMBOSSED PLASTIC, 7 INCH
|
|
Positive Tolerance |
10%
|
10%
|
Rated (DC) Voltage (URdc) |
25 V
|
25 V
|
Size Code |
1206
|
1206
|
Surface Mount |
YES
|
YES
|
Temperature Characteristics Code |
X7R
|
X7R
|
Temperature Coefficient |
15% ppm/°C
|
15% ppm/°C
|
Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
1206
|
|
|
|
Compare CL31B475KAHVPNE with alternatives
Compare CL31B475KAHNNWE with alternatives