CHP2010K56R2FGT vs CHP2010K56R2FB131 feature comparison

CHP2010K56R2FGT Vishay Intertechnologies

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CHP2010K56R2FB131 Vishay Intertechnologies

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Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer VISHAY INTERTECHNOLOGY INC VISHAY INTERTECHNOLOGY INC
Package Description CHIP
Reach Compliance Code compliant compliant
Factory Lead Time 24 Weeks
Construction Rectangular Chip
JESD-609 Code e4 e0
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.5 mm 0.5 mm
Package Length 5.03 mm 5.08 mm
Package Style SMT SMT
Package Width 2.64 mm 2.54 mm
Packing Method TR, PLASTIC Waffle Pack
Rated Power Dissipation (P) 1 W 1 W
Rated Temperature 70 °C
Resistance 56.2 Ω 56.2 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish GOLD OVER NICKEL Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 2 1
ECCN Code EAR99
Reference Standard MIL-R-55342D

Compare CHP2010K56R2FGT with alternatives

Compare CHP2010K56R2FB131 with alternatives