CH5225B-37
vs
MMSZ5225B-V-GS08
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
VISHAY INTERTECHNOLOGY INC
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
R-XUUC-N1
|
R-PDSO-G2
|
JESD-609 Code |
e0
|
e3
|
Knee Impedance-Max |
1600 Ω
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
1
|
2
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
3 V
|
3 V
|
Reverse Current-Max |
50 µA
|
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
UPPER
|
DUAL
|
Voltage Temp Coeff-Max |
|
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
20 mA
|
20 mA
|
Base Number Matches |
2
|
1
|
Package Description |
|
ROHS COMPLIANT, PLASTIC PACKAGE-2
|
Samacsys Manufacturer |
|
Vishay
|
Dynamic Impedance-Max |
|
30 Ω
|
Moisture Sensitivity Level |
|
1
|
Operating Temperature-Max |
|
150 °C
|
|
|
|
Compare CH5225B-37 with alternatives
Compare MMSZ5225B-V-GS08 with alternatives