CH5225B-37 vs MMSZ5225BT3G feature comparison

CH5225B-37 Microsemi Corporation

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MMSZ5225BT3G onsemi

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP ON SEMICONDUCTOR
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code R-XUUC-N1 R-PDSO-G2
JESD-609 Code e0 e3
Knee Impedance-Max 1600 Ω
Number of Elements 1 1
Number of Terminals 1 2
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3 V 3 V
Reverse Current-Max 50 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Voltage Temp Coeff-Max
Voltage Tol-Max 5% 5%
Working Test Current 20 mA 20 mA
Base Number Matches 1 1
Pbfree Code Yes
Package Description R-PDSO-G2
Pin Count 2
Manufacturer Package Code CASE 425-04
Dynamic Impedance-Max 29 Ω
Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C

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