CGA3E1X5R1C225K080AC vs C1608X5R1C225K080AB feature comparison

CGA3E1X5R1C225K080AC TDK Corporation

Buy Now Datasheet

C1608X5R1C225K080AB TDK Corporation

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TDK CORP TDK CORP
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8532.24.00.20 8532.24.00.20
Factory Lead Time 16 Weeks, 3 Days
Capacitance 2.2 µF 2.2 µF
Capacitor Type CERAMIC CAPACITOR CERAMIC CAPACITOR
Dielectric Material CERAMIC CERAMIC
Height 0.8 mm 0.8 mm
JESD-609 Code e3 e3
Length 1.6 mm 1.6 mm
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Multilayer Yes Yes
Negative Tolerance 10% 10%
Number of Terminals 2 2
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Packing Method TR, 7 INCH TR, 7 Inch
Positive Tolerance 10% 10%
Rated (DC) Voltage (URdc) 16 V 16 V
Reference Standard AEC-Q200
Size Code 0603 0603
Surface Mount YES YES
Temperature Characteristics Code X5R X5R
Temperature Coefficient 15% ppm/°C 15% ppm/°C
Terminal Finish MATTE TIN OVER NICKEL Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Width 0.8 mm 0.8 mm
Base Number Matches 1 2

Compare CGA3E1X5R1C225K080AC with alternatives

Compare C1608X5R1C225K080AB with alternatives