CDP1855CD
vs
CDP1855CDX
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTERSIL CORP
|
HARRIS SEMICONDUCTOR
|
Part Package Code |
DIP
|
|
Package Description |
HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28
|
DIP-28
|
Pin Count |
28
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
3.2 MHz
|
3.2 MHz
|
External Data Bus Width |
3
|
3
|
JESD-30 Code |
R-CDIP-T28
|
R-CDIP-T28
|
JESD-609 Code |
e0
|
e0
|
Low Power Mode |
NO
|
NO
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Data Bus Width |
8
|
8
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP28,.6
|
DIP28,.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
6.5 V
|
6.5 V
|
Supply Voltage-Min |
4 V
|
4 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER
|
DSP PERIPHERAL, MULTIPLIER
|
Base Number Matches |
2
|
1
|
|
|
|
Compare CDP1855CD with alternatives
Compare CDP1855CDX with alternatives