CDP1854ACDX
vs
CDP1854ACCQ
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
HARRIS SEMICONDUCTOR
|
| Package Description |
DIP,
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
1
|
1
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
1800
|
1800
|
| Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT
|
| Data Encoding/Decoding Method |
NRZ
|
NRZ
|
| Data Transfer Rate-Max |
0.0244140625 MBps
|
0.0244140625 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-CDIP-T40
|
S-PQCC-J44
|
| Low Power Mode |
NO
|
NO
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
40
|
44
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Supply Voltage-Max |
6.5 V
|
6.5 V
|
| Supply Voltage-Min |
4 V
|
4 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Position |
DUAL
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
1
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
|
|
| On Chip Data RAM Width |
|
|
| Qualification Status |
|
Not Qualified
|
| RAM (words) |
|
0
|
|
|
|
Compare CDP1854ACDX with alternatives
Compare CDP1854ACCQ with alternatives