CDP1806ACD vs Z8400BD6 feature comparison

CDP1806ACD Harris Semiconductor

Buy Now Datasheet

Z8400BD6 STMicroelectronics

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR STMICROELECTRONICS
Package Description DIP, DIP40,.6 DIP, DIP40,.6
Reach Compliance Code unknown not_compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature 8-BIT TIMER DRAM REFRESH CONTROLLER
Address Bus Width 8 16
Bit Size 8 8
Boundary Scan NO NO
Clock Frequency-Max 5 MHz 6 MHz
External Data Bus Width 8 8
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-CDIP-T40 R-CDIP-T40
JESD-609 Code e0 e0
Low Power Mode YES NO
Number of DMA Channels 1
Number of External Interrupts 1 2
Number of Serial I/Os
Number of Terminals 40 40
On Chip Data RAM Width
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP40,.6 DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Speed 5 MHz 6 MHz
Supply Current-Max 0.2 mA 200 mA
Supply Voltage-Max 6.5 V 5.25 V
Supply Voltage-Min 4 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS NMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 2 1
Part Package Code DIP
Pin Count 40
Seated Height-Max 3.6 mm
Width 15.24 mm

Compare CDP1806ACD with alternatives

Compare Z8400BD6 with alternatives