CDLL829E3 vs 1N829UR-1%E3TR feature comparison

CDLL829E3 Microsemi Corporation

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1N829UR-1%E3TR Microsemi Corporation

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Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description O-LELF-R2 ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AA DO-213AA
JESD-30 Code O-LELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Power Dissipation-Max 0.5 W 0.5 W
Reference Voltage-Nom 6.2 V 6.2 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Temp Coeff-Max 0.031 mV/°C 0.031 mV/°C
Voltage Tol-Max 4.84% 4.84%
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DO-213AA
Pin Count 2
JESD-609 Code e3
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40

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