CDLL5221CE3 vs MSP1N5223AE3TR feature comparison

CDLL5221CE3 Microsemi Corporation

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MSP1N5223AE3TR Microsemi Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description O-LELF-R2 O-LALF-W2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AA DO-204AA
JESD-30 Code O-LELF-R2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Reference Voltage-Nom 2.4 V 2.7 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Voltage Tol-Max 2% 10%
Working Test Current 20 mA 20 mA
Base Number Matches 1 1
Rohs Code Yes
Part Package Code DO-7
Pin Count 2
JESD-609 Code e3
Moisture Sensitivity Level 1
Power Dissipation-Max 0.417 W
Qualification Status Not Qualified
Terminal Finish MATTE TIN

Compare CDLL5221CE3 with alternatives

Compare MSP1N5223AE3TR with alternatives