CDLL5221CE3 vs 1N5223D-BP feature comparison

CDLL5221CE3 Microsemi Corporation

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1N5223D-BP Micro Commercial Components

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICRO COMMERCIAL COMPONENTS CORP
Package Description O-LELF-R2 GLASS PACKAGE-2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AA DO-35
JESD-30 Code O-LELF-R2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Reference Voltage-Nom 2.4 V 2.7 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Voltage Tol-Max 2% 1%
Working Test Current 20 mA 20 mA
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DO-35
Pin Count 2
JESD-609 Code e3
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max 0.5 W
Qualification Status Not Qualified
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 10

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