CDLL3039CE3 vs MQ1N4759CURE3TR feature comparison

CDLL3039CE3 Microsemi Corporation

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MQ1N4759CURE3TR Microsemi Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description O-LELF-R2 O-LELF-R2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED TR, 7 INCH; 1500
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AB DO-213AB
JESD-30 Code O-LELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Reference Voltage-Nom 62 V 62 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 2% 2%
Working Test Current 4 mA 4 mA
Base Number Matches 1 1
Rohs Code Yes
Part Package Code DO-213AB
Pin Count 2
JESD-609 Code e3
Qualification Status Not Qualified
Reference Standard MIL-19500
Terminal Finish MATTE TIN

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