CDCU877RHAT
vs
IDTCSPU877ABVG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFN
BGA
Package Description
QFN-40
TFBGA, BGA52,6X10,25
Pin Count
40
52
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Family
877
877
Input Conditioning
DIFFERENTIAL
DIFFERENTIAL
JESD-30 Code
S-PQCC-N40
R-PBGA-B52
JESD-609 Code
e4
e1
Length
6 mm
7 mm
Logic IC Type
PLL BASED CLOCK DRIVER
PLL BASED CLOCK DRIVER
Max I(ol)
0.009 A
0.009 A
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
40
52
Number of True Outputs
10
10
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
TFBGA
Package Equivalence Code
LCC40,.24SQ,20
BGA52,6X10,25
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.035 ns
0.04 ns
Seated Height-Max
1 mm
1.05 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
NO LEAD
BALL
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
6 mm
4.5 mm
fmax-Min
340 MHz
340 MHz
Base Number Matches
1
1
Compare CDCU877RHAT with alternatives
Compare IDTCSPU877ABVG with alternatives