CD74HCT688H
vs
CD54HCT688F
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
| Package Description |
, DIE OR CHIP
|
DIP-20
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Logic IC Type |
MAGNITUDE COMPARATOR
|
MAGNITUDE COMPARATOR
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Code |
DIE
|
DIP
|
| Package Equivalence Code |
DIE OR CHIP
|
DIP20,.3
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Base Number Matches |
5
|
7
|
| Rohs Code |
|
No
|
| JESD-30 Code |
|
R-XDIP-T20
|
| JESD-609 Code |
|
e0
|
| Number of Terminals |
|
20
|
| Package Body Material |
|
CERAMIC
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Surface Mount |
|
NO
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
|
|
|