CD74HCT259EE4
vs
935187400118
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
DIP
SOIC
Package Description
DIP, DIP16,.3
SOT-338-1, SSOP-16
Pin Count
16
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Additional Feature
1:8 DMUX FOLLOWED BY LATCH
1:8 DMUX FOLLOWED BY LATCH
Family
HCT
HCT
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
JESD-609 Code
e4
e4
Length
19.305 mm
6.2 mm
Load Capacitance (CL)
50 pF
Logic IC Type
D LATCH
D LATCH
Max I(ol)
0.004 A
Number of Bits
8
1
Number of Functions
4
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SSOP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, SHRINK PITCH
Packing Method
TUBE
Power Supply Current-Max (ICC)
0.08 mA
Prop. Delay@Nom-Sup
49 ns
Propagation Delay (tpd)
57 ns
57 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
5.08 mm
2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Trigger Type
LOW LEVEL
LOW LEVEL
Width
7.62 mm
5.3 mm
Base Number Matches
1
1
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare CD74HCT259EE4 with alternatives
Compare 935187400118 with alternatives