935187400118
vs
74HCT259D-T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEXPERIA
NXP SEMICONDUCTORS
Package Description
SSOP,
SOP, SOP16,.25
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
1:8 DMUX FOLLOWED BY LATCH
1:8 DMUX FOLLOWED BY LATCH
Family
HCT
HCT
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
e4
Length
6.2 mm
9.9 mm
Logic IC Type
D LATCH
D LATCH
Moisture Sensitivity Level
1
1
Number of Bits
1
1
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
57 ns
57 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Trigger Type
LOW LEVEL
LOW LEVEL
Width
5.3 mm
3.9 mm
Base Number Matches
2
3
Part Package Code
SOIC
Pin Count
16
Load Capacitance (CL)
50 pF
Max I(ol)
0.00002 A
Package Equivalence Code
SOP16,.25
Packing Method
TR
Prop. Delay@Nom-Sup
59 ns
fmax-Min
60 MHz
Compare 935187400118 with alternatives
Compare 74HCT259D-T with alternatives