CD74HCT138MTE4 vs TC74HCT138AFN(ELP) feature comparison

CD74HCT138MTE4 Texas Instruments

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TC74HCT138AFN(ELP) Toshiba America Electronic Components

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Lifetime Buy
Ihs Manufacturer TEXAS INSTRUMENTS INC TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description PLASTIC, MS-012AC, SOIC-16 SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Additional Feature TWO ACTIVE LOW AND ONE ACTIVE HIGH ENABLE INPUTS 3 ENABLE INPUTS
Family HCT HCT
Input Conditioning STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER OTHER DECODER/DRIVER
Max I(ol) 0.004 A
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Prop. Delay@Nom-Sup 53 ns
Propagation Delay (tpd) 53 ns 44 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 3.9 mm 3.9 mm
Base Number Matches 1 1

Compare CD74HCT138MTE4 with alternatives

Compare TC74HCT138AFN(ELP) with alternatives