CD74HC283MTE4 vs TC74HC283AFN-TP1ELP feature comparison

CD74HC283MTE4 Texas Instruments

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TC74HC283AFN-TP1ELP Toshiba America Electronic Components

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP16,.25 SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH FULL INTERNAL LOOKAHEAD FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4
Length 9.9 mm 9.9 mm
Logic IC Type ADDER/SUBTRACTOR ADDER/SUBTRACTOR
Moisture Sensitivity Level 1
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 315 ns 53 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 3.9 mm
Base Number Matches 2 1
Load Capacitance (CL) 50 pF

Compare CD74HC283MTE4 with alternatives

Compare TC74HC283AFN-TP1ELP with alternatives