TC74HC283AFN-TP1ELP vs GD74HC283D feature comparison

TC74HC283AFN-TP1ELP Toshiba America Electronic Components

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GD74HC283D LG Semicon Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP LG SEMICON CO LTD
Part Package Code SOIC
Package Description SOP, SOP, SOP16,.25
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING
Family HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type ADDER/SUBTRACTOR ADDER/SUBTRACTOR
Number of Bits 4
Number of Functions 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 53 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Package Equivalence Code SOP16,.25
Terminal Finish Tin/Lead (Sn/Pb)

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