CD74AC32EX vs MC74AC32NC feature comparison

CD74AC32EX Ge Solid State

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MC74AC32NC Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GE SOLID STATE MOTOROLA INC
Package Description , DIP,
Reach Compliance Code unknown unknown
Family AC AC
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 9.5 ns 7.5 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 1.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIP
Pin Count 14
HTS Code 8542.39.00.01
Length 18.86 mm
Seated Height-Max 4.69 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare CD74AC32EX with alternatives

Compare MC74AC32NC with alternatives