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CD5537B vs CD5537BE3 feature comparison

CD5537B Microchip Technology Inc

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CD5537BE3 Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description DIE-1 S-XXUC-N2
Reach Compliance Code compliant compliant
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 100 Ω
JESD-30 Code S-XUUC-N1 S-XUUC-N1
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 1 1
Operating Temperature-Max 200 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape SQUARE SQUARE
Package Style UNCASED CHIP UNCASED CHIP
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified
Reference Voltage-Nom 17 V 17 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Voltage Tol-Max 5% 5%
Working Test Current 1 mA 1 mA
Base Number Matches 7 1
ECCN Code EAR99
HTS Code 8541.10.00.50
Diodes » Zener Diodes
Diodes » Zener Diodes

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