CD5537B
vs
JANTX1N5537B-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
DIE-1
HERMETIC SEALED, GLASS, DO-35, 2 PIN
Reach Compliance Code
unknown
compliant
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
100 Ω
JESD-30 Code
S-XUUC-N1
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
1
2
Operating Temperature-Max
200 °C
175 °C
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
17 V
17 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
WIRE
Terminal Position
UPPER
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
1 mA
1 mA
Base Number Matches
7
9
Factory Lead Time
20 Weeks
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
JEDEC-95 Code
DO-204AH
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500
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