CD5537B vs JANTX1N5537B-1 feature comparison

CD5537B Microsemi Corporation

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JANTX1N5537B-1 Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description DIE-1 HERMETIC SEALED, GLASS, DO-35, 2 PIN
Reach Compliance Code unknown compliant
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 100 Ω
JESD-30 Code S-XUUC-N1 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 1 2
Operating Temperature-Max 200 °C 175 °C
Package Body Material UNSPECIFIED GLASS
Package Shape SQUARE ROUND
Package Style UNCASED CHIP LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Qualified
Reference Voltage-Nom 17 V 17 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD WIRE
Terminal Position UPPER AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 1 mA 1 mA
Base Number Matches 7 9
Factory Lead Time 20 Weeks
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED
JEDEC-95 Code DO-204AH
Operating Temperature-Min -65 °C
Reference Standard MIL-19500

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