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CD54HCT40105F/3 vs 74HC40105N,652 feature comparison

CD54HCT40105F/3 Intersil Corporation

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74HC40105N,652 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP NXP SEMICONDUCTORS
Package Description , 0.300 INCH, PLASTIC, MO-001AE, SOT-38-1, DIP-16
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.71 8542.39.00.01
Access Time-Max 120 ns 600 ns
Cycle Time 100 ns 71.428 ns
JESD-30 Code R-CDIP-T16 R-PDIP-T16
Memory Density 64 bit 64 bit
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 16 words 16 words
Number of Words Code 16 16
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Organization 16X4 16X4
Output Enable YES YES
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 1
Rohs Code Yes
Part Package Code DIP
Pin Count 16
Manufacturer Package Code SOT38-4
Factory Lead Time 4 Weeks
Additional Feature REGISTER BASED; BUBBLE BACK 750NS
Clock Frequency-Max (fCLK) 14 MHz
JESD-609 Code e4
Length 21.6 mm
Memory IC Type OTHER FIFO
Output Characteristics 3-STATE
Package Code DIP
Package Equivalence Code DIP16,.3
Peak Reflow Temperature (Cel) 260
Seated Height-Max 4.7 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm
Memory » FIFOs
Memory » FIFOs

Compare CD54HCT40105F/3 with alternatives

Compare 74HC40105N,652 with alternatives