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74HC40105N,652 vs 74HC40105N feature comparison

74HC40105N,652 NXP Semiconductors

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74HC40105N Philips Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code DIP
Package Description 0.300 INCH, PLASTIC, MO-001AE, SOT-38-1, DIP-16 DIP, DIP16,.3
Pin Count 16
Manufacturer Package Code SOT38-4
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.32.00.71
Factory Lead Time 4 Weeks
Access Time-Max 600 ns
Additional Feature REGISTER BASED; BUBBLE BACK 750NS
Clock Frequency-Max (fCLK) 14 MHz 14 MHz
Cycle Time 71.428 ns
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e4
Length 21.6 mm
Memory Density 64 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 4 4
Number of Functions 1
Number of Terminals 16 16
Number of Words 16 words 16 words
Number of Words Code 16 16
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16X4 16X4
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.7 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm
Base Number Matches 1 2
ECCN Code EAR99
Memory » FIFOs
Memory » FIFOs

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