CD54HCT175H/3A
vs
GD74HCT175J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
GOLDSTAR ELECTRON CO LTD
Package Description
DIE,
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
X-XUUC-N16
R-CDIP-T16
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIE
DIP
Package Equivalence Code
DIE OR CHIP
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Propagation Delay (tpd)
50 ns
42 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
25 MHz
22 MHz
Base Number Matches
1
1
Load Capacitance (CL)
50 pF
Compare CD54HCT175H/3A with alternatives
Compare GD74HCT175J with alternatives