CD54HC368F3A vs TC74HC368AFN(ELP) feature comparison

CD54HC368F3A Rochester Electronics LLC

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TC74HC368AFN(ELP) Toshiba America Electronic Components

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC TOSHIBA AMERICA ELECTRONIC COMPONENTS INC
Part Package Code DIP SOIC
Package Description DIP, 0.150 INCH, PLASTIC, SOIC-16
Pin Count 16 16
Reach Compliance Code unknown unknown
Additional Feature ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO BITS
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T16 R-PDSO-G16
JESD-609 Code e0
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 6 6
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Base Number Matches 2 2
Length 9.9 mm
Load Capacitance (CL) 150 pF
Propagation Delay (tpd) 33 ns
Qualification Status Not Qualified
Seated Height-Max 1.75 mm
Terminal Pitch 1.27 mm
Width 3.9 mm

Compare CD54HC368F3A with alternatives

Compare TC74HC368AFN(ELP) with alternatives