CD54HC251F3A
vs
MC74HC251N
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
MOTOROLA INC
|
Package Description |
DIP, DIP16,.3
|
DIP,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-GDIP-T16
|
R-PDIP-T16
|
JESD-609 Code |
e0
|
e0
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.004 A
|
|
Number of Functions |
1
|
1
|
Number of Inputs |
8
|
8
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Prop. Delay@Nom-Sup |
53 ns
|
|
Propagation Delay (tpd) |
265 ns
|
62 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
3
|
Pbfree Code |
|
No
|
Part Package Code |
|
DIP
|
Pin Count |
|
16
|
Length |
|
19.175 mm
|
Seated Height-Max |
|
4.44 mm
|
Width |
|
7.62 mm
|
|
|
|
Compare CD54HC251F3A with alternatives
Compare MC74HC251N with alternatives