CD54HC251F3A vs MC54HC251J feature comparison

CD54HC251F3A Texas Instruments

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MC54HC251J Freescale Semiconductor

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Pbfree Code Yes
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Pin Count 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family HC/UH
JESD-30 Code R-GDIP-T16 R-XDIP-T16
JESD-609 Code e0 e0
Length 19.56 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.0052 A 0.004 A
Number of Bits 2
Number of Functions 1 1
Number of Inputs 8 8
Number of Outputs 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Power Supply Current-Max (ICC) 0.16 mA
Prop. Delay@Nom-Sup 21 ns 56 ns
Propagation Delay (tpd) 370 ns
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 3
Power Supplies 2/6 V

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