CD4515BMJ vs HCC4515BF feature comparison

CD4515BMJ Texas Instruments

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HCC4515BF STMicroelectronics

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP STMICROELECTRONICS
Package Description DIP, DIP24,.6 DIP, DIP24,.6
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
Input Conditioning LATCHED LATCHED
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER 4-LINE TO 16-LINE DECODER
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity INVERTED INVERTED
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.6 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 1100 ns 970 ns
Propagation Delay (tpd) 1100 ns 970 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 5.71 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 3 1
Part Package Code DIP
Pin Count 24
Additional Feature ADDRESS LATCHES

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