HCC4515BF
vs
CD4515BFMSR
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
DIP, DIP24,.6
DIP, DIP24,.6
Pin Count
24
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ADDRESS LATCHES
ADDRESS LATCHES
Family
4000/14000/40000
4000/14000/40000
Input Conditioning
LATCHED
LATCHED
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
4-LINE TO 16-LINE DECODER
4-LINE TO 16-LINE DECODER
Number of Functions
1
1
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.6
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
970 ns
1310 ns
Propagation Delay (tpd)
970 ns
1310 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.71 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
1
2
Max I(ol)
0.00035999999999999997 A
Screening Level
38535V;38534K;883S
Total Dose
100k Rad(Si) V
Compare HCC4515BF with alternatives
Compare CD4515BFMSR with alternatives