CD4514BCN
vs
HEF4514BDF
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Package Description |
PLASTIC, DIP-24
|
DIP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| Additional Feature |
ADDRESS LATCHES
|
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDIP-T24
|
R-GDIP-T24
|
| JESD-609 Code |
e0
|
|
| Length |
31.915 mm
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
OTHER DECODER/DRIVER
|
4-LINE TO 16-LINE DECODER
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Prop. Delay@Nom-Sup |
1100 ns
|
|
| Propagation Delay (tpd) |
1100 ns
|
520 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.334 mm
|
5.84 mm
|
| Supply Voltage-Max (Vsup) |
15 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
15.24 mm
|
| Base Number Matches |
4
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
24
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Input Conditioning |
|
LATCHED
|
|
|
|
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